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Electronic Design and Analysis Engineer -FPGA

The Boeing Company


Location:
Bangalore, Karnataka
Date:
08/17/2017
2017-08-172017-09-15
Job Code:
1700012081
Categories:
  • Engineering
The Boeing Company
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Job Details

Electronic Design and Analysis Engineer -FPGA Jobs in Bengaluru at Boeing

Electronic Design and Analysis Engineer -FPGA

Company Boeing India Services Private Limited Job ID 1700012081 Date posted 08/04/2017
Location Bangalore Karnataka India
Job Description
.
Boeing is the world's largest aerospace company and leading manufacturer of commercial airplanes and defense, space and security systems. We are engineers and technicians. Skilled scientists and thinkers. Bold innovators and dreamers. Join us, and you can build something better for yourself, for our customers and for the world.
 
The Boeing India Engineering and Technology Center (BIETC) is looking for highly-motivated Electronic Design and Analysis Engineers. You will be part of the Boeing Avionics Team and will focus on electronic hardware development. 
 
Job Description:
 
  • You will analyze customer and system requirements to develop architectural approaches and detailed specifications for various electronic products
  • Develop designs consistent with requirements and specifications
  • Validate designs through various methods of review, testing and analysis. Identifies, tracks and statuses technical performance measures to measure progress and ensure compliance with requirements
  • Support Supplier Management with make/buy recommendations and other technical services
  • Provide engineering support throughout the lifecycle of the product
  • Investigate emerging technologies to develop concepts for future product designs to meet projected requirements.
 
Experience desired in one or more of the following areas: Development of detailed design specifications for Avionics; Performance of Technical Research and Trade Studies to support product designs; Development of electronics unit internal architectures; Development of requirements and detailed ASIC/FPGA designs per DO-254; Development of detailed circuit and/or electronics packaging including chassis and printed circuit design; Development of electronics test and verification plans; Hands on experience with electronics hardware drawings, procedures, design for manufacturability and test; and technical analysis demonstrating performance margin of circuits or mechanical features.
 

Division
Engineering Core

Relocation Assistance Available
No. Relocation assistance is not a negotiable benefit.

Qualifications
Engineering degree and 5+ years of related work experience, a Master's degree and 4+ years' related work experience or an equivalent combination of education and experience. 
 
All information provided will be checked and may be verified. This requisition is for an international, locally hired position. Candidates must be legally authorized to work in India. Boeing will not seek immigration and labor sponsorship for any applicants; this is the responsibility of the job candidate. Benefits and pay are determined at the local level and are not part of Boeing U.S.-based payroll. RELOCATION BENEFITS IF INDICATED ARE LIMITED TO IN-COUNTRY MOVES AND ARE NOT AVAILABLE FOR OVERSEAS RELOCATION. THERE IS NO EXPATRIATE PACKAGE ASSOCIATED WITH THIS POSITION.

Experience Level
Individual Contributor

Job Type
Standard

Travel
Yes, 10 % of the Time

Contingent Upon Program Award
No

Union
No

Job Code
6B1DX2
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